Semiconductor Engineering - Deep Insights For Chip Engineers
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors.
Semiconductor Engineering’s Special Reports 2024
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Chip Industry Week In Review - Semiconductor Engineering
6 days ago · Markets and Money. KPMG and the Global Semiconductor Alliance surveyed semiconductor executives about their outlook for the industry in 2025. A preview of the report notes a widespread expectation of continued revenue growth, with AI the key driver.. Cadstrom raised $6.8 million in seed funding for its AI-driven validation tools …
Navigating Increased Complexity In Advanced Packaging
Dec 17, 2024 · As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything from process control and in-line ...
Why Chips Fail, And What To Do About It - Semiconductor …
Dec 11, 2024 · Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips in the context of safety- and mission-critical systems, as well as increasing utilization due to an explosion in AI data, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief ...
Semiconductor Engineering - Blogs Homepage
6 days ago · Semiconductor Engineering published 36 special reports in 2024. Focus Areas Manufacturing, Packaging, Materials Test, Measurement New Fabs and Funding Memory Design Power, Performance Manufacturing, Packaging, Materials Navigating Increased Complexity In Advanced Packaging Intel Vs.
Chip Industry Week In Review - Semiconductor Engineering
Nov 8, 2024 · Money and Markets. Chip industry acquisitions this week: India’s Tessolve Semiconductor will acquire Germany’s Dream Chip Technologies for ~$48M.; Macom acquired ENGIN-IC, a U.S. fabless GaN monolithic microwave IC company.; Japan’s Hamamatsu Photonics purchased the stock of BAE Systems Imaging Solutions, a subsidiary of BAE Systems, emerging with its original name Fairchild Imaging.
Chip Industry Week In Review - Semiconductor Engineering
Sep 27, 2024 · Markets and Money. Ephos raised $8.5M in a seed round and opened the world’s first facility for design and production of glass-based quantum photonic chips, in Milan, Italy.. Oracle disclosed that it owns 29% of startup Ampere, which is exploring a potential sale, according to Bloomberg.. Micron released earnings this week, with strong revenue growth from data center DRAM and HBM products.
Chip Industry Week In Review - Semiconductor Engineering
Sep 13, 2024 · Infineon rolled out the world’s first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors.A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon’s 300mm GaN wafer. Source: Infineon. The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report this ...
Semiconductor Engineering - About Us
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful ...