Design And Reuse, The System-On-Chip Design Resource - IP, …
Design And Reuse, The Web's System On Chip Design Resource : catalogs of IPs, Virtual Components, Cores for designing System-on-Chip (SOC)
Early Interactive Short Isolation for Faster SoC Verification
By Ritu Walia, Siemens (December 4, 2024) In modern semiconductor design, shrinking technology nodes and increasing circuit complexity make layout versus schematic (LVS) …
Alphawave IP - Announcement regarding leadership transition
LONDON, United Kingdom and TORONTO, Ontario, Canada -- December 5, 2024 – Alphawave IP Group plc (LSE: AWE, the “Company” or “Alphawave Semi”) today announces that John …
IP players prominent in chiplet's 2024 diary - design-reuse.com
While large semiconductor outfits like AMD and Intel were initially prominent in the chiplets world, IP players are now increasingly visible in showcasing the potential of chiplets. That includes …
Now Gelsinger is gone, what is Intel's Plan B?
By Peter Clarke, EETimes Europe (December 2, 2024) What is Intel going to do next? Do key decisions have to wait while the company finds a CEO to replace Pat Gelsinger, and where …
HDMI 2.1 Tx PHY in TSMC (16nm, 12nm, N7, N6, N4, N3E)
The Synopsys HDMI 2.1 TX Controller and PHY IP solutions,compliant with the High-Definition Multimedia Interface (HDMI) 2.1 specification, provide the necessary logic to implement and …
Bounds in Placement - Design And Reuse
A placement bound is a constraint that controls the placement of groups of leaf cells and hierarchical cells. It allows us to group the cells and minimize the wire length. It helps us to …
Advanced Packaging and Chiplets Can Be for Everyone
The chiplet revolution is upon us. What began in laboratories as multi-die science projects has eventually evolved. A giant company like AMD, Intel or Nvidia can produce—either at TSMC …
D&R Silicon IP Catalog: Directory of Semiconductor IP - Design …
D&R provides the world's largest directory of Silicon IP (Intellectual Property), SoC Configurable Design Platforms and SOPC Products from 400 vendors
Advancing Die-to-Die Connectivity: The Next-Generation UCIe IP …
Oct 21, 2024 · In today’s evolving AI/ML and HPC/datacenter landscapes, die-to-die connectivity is essential for achieving high-performance and efficient data transfer. ...