Despite TSMC estimating that the mass production of silicon photonic (SiPh) co-packaged optics (CPO) technology will still ...

TSMC's Arizona Fab 21 has begun mass production of 4nm chips, targeting 30,000 wafers monthly by mid-year. Expansion phases will support 2nm tech by 2027. Meanwhile, TSMC eyes Texas for advanced ...

According to Taiwan’s United Daily News, Taiwan Semiconductor Manufacturing plans to build a 1 nm process fab in southern Taiwan, reported The ...

Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest contract chipmaker, plans to build a 1 nm process fab ...

Despite the US's new tariff policy and other macroeconomic circumstances, TSMC is on track to boost its 2nm and advanced ...

According to reports, the Giga-Fab, designated as Fab 25, will house six fabs. Industry sources say TSMC has submitted a land ...

Although construction on Fab 21 in Arizona originally ran into delays, it is now making 4nm chips for Apple, according to a recent report. And with Taiwan’s regulators clearing the way for TSMC ...

Jan. 21, 2025 (GLOBE NEWSWIRE ... today announced that the first patient has been dosed in the CONVERGE study, a Phase 2 randomized controlled clinical trial evaluating potential first-in ...

TSMC’s Fab 18 and Fab 6 are in the Southern Taiwan Science Park. Fab 18 runs 5 nm and 3 nm processes and Fab 6 is an eight inch fab. In the central Taiwan Science Park, TSMC has Fab 15 (pictured) ...

TSMC said last year that its first Arizona fab was on schedule to begin producing ... so new technology delays are more relevant for the upcoming 2 nm and 1.6 nm chips expected to be more ...

TSMC’s CoWoS is a 2.5D semiconductor packaging technology that increases the number of I/O points while reducing interconnect length between logic and memory components. However, emerging HPC ...

TSMC has officially commenced mass production of advanced 4nm chips at its Fab 21 facility in Arizona ... currently operates Phase 1A with a production capacity of approximately 10,000 wafers ...