Semiconductor Engineering - Deep Insights For Chip Engineers
WEBSeptember 16th, 2024 By Karen Heyman. Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors.
Chip Industry Week In Review - Semiconductor Engineering
WEB11 hours ago · October 4th, 2024 - By: The SE Staff. Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor’s planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS).
Partitioning In The Chiplet Era - Semiconductor Engineering
WEB1 day ago · At the heart of any design involving chiplets are partitioning and prioritization. “This is because what is best implemented in 7nm, for example, an I/O, a SerDes, or PCIe PHY is really optimal technology node for that particular function,” Giuliano said. “This can also be referred to as domain-specific disaggregation.
Semiconductor Engineering - knowledge-center
WEBA design or verification unit that is pre-packed and available for licensing. Separate electronic devices using Internet or other connections to communicate among the devices. Usually sensors or actuators are sending data to a computing hub. Semiconductor materials enable electronic circuits to be constructed.
How Is The Chip Industry Really Doing? - Semiconductor …
WEBJan 17, 2024 · According to a just released report from SEMI’s Electronic Design Market Data Report, EDA and IP revenue hit $4.7 billion in Q3 (the latest data available), while the chip industry supposedly was in a downturn. That was a 25.2% increase year-over-year, and IP physical design and verification jumped 45.3%, which is well beyond the exploratory ...
New Transistor Structures At 3nm/2nm - Semiconductor …
WEBJan 25, 2021 · Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect transistors (GAA FETs) at the 3nm and 2nm nodes, starting either next year or in 2023. GAA FETs hold the promise of better performance, lower power, and lower leakage, and they will be …
Semiconductor Engineering - About Us
WEBSemiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful ...
Working With Chiplets - Semiconductor Engineering
WEB2 days ago · Working With Chiplets. What comes after HBM, and why that matters for future designs. The usual method of migrating to the next process node to cram more features onto a piece of silicon no longer works. It’s too expensive, and too limited for most applications. The path forward is now heterogeneous chiplets targeted at …
Power Semis Usher In The Silicon Carbide Era - Semiconductor …
WEBAug 21, 2023 · Many thousands of power semiconductor modules already are in use in electric vehicles for on-board charging, traction inversion, and DC-to-DC conversion. Today, most of those are fabricated using silicon-based IGBTs. A shift to silicon carbide-based MOSFETs doubles the power density and accelerates switching speed in a smaller and lighter package.
What Is An Integrated Circuit? - Semiconductor Engineering
WEBAug 10, 2023 · Integrated circuits are compact electronic chips made up of interconnected components that include resistors, transistors, and capacitors. Built on a single piece of semiconductor material, such as silicon, integrated circuits can contain collections of hundreds to billions of components — all working together to make our world go ‘round.